Abstract:
Rapid industrial growth in the global wafer manufacturing sector has intensified solid waste
generation and resource inefficiency, particularly in developing economies such as Sri Lanka,
where expansion often outpaces the establishment of robust environmental controls. This study
employed process flow mapping, quantitative material balance analysis, and targeted on-site
waste auditing across key production stages mixing, baking, creaming, cutting, and packing to
systematically identify process inefficiencies and waste hotspots. Findings revealed a total
waste generation of approximately 890 kg per day, with the baking and cutting phases
contributing over 55% of the total, mainly through plain sheet discards, cutter trims, and oven
lumps. These wastes originated from suboptimal thermal management, mechanical
misalignment, and insufficient operator oversight, indicating systemic weaknesses in process
control and maintenance practices. The absence of Standard Operating Procedures (SOPs)
further exacerbated inefficiencies, leading to poor equipment calibration, irregular
maintenance, and inadequate process monitoring, resulting in mechanical failures such as oven
overheating, sensor malfunctions, and conveyor misalignment. Such operational lapses not only
increase material and energy losses but also hinder productivity and sustainability performance.
The study recommends strategic interventions including advanced equipment calibration,
proactive preventive maintenance, intensive workforce training, and the establishment of
comprehensive SOPs to standardize operations. Implementation of these measures supports the
achievement of Sustainable Development Goals (SDGs) 9 and 12, promoting industry
innovation, resource efficiency, and responsible production practices aligned with waste
reduction and circular economy practices as emphasized in the waste management policy in Sri
Lanka.
